Highlights
Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.
About the Course Provider
Coursera provides access to more than 3000+ courses across a wide variety of subjects in parntership with different universities and organizations.
